• Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type
  • Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type
  • Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type
  • Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type
  • Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type
Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type

Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type

Product Details:

Place of Origin: China
Brand Name: Tian Rui
Certification: UL ROHS
Model Number: 1206 T

Payment & Shipping Terms:

Minimum Order Quantity: 2000PCS
Price: USD0.04-0.06PCS
Packaging Details: 3000pcs Tape&Reel
Delivery Time: 5-7 Days
Payment Terms: D/P, T/T,Paypal, Western Union
Supply Ability: 1000000PCS/Month
Get Best Price Contact Now

Detail Information

Rated Current: 250mA-10A Rated Voltage: 125Vdc/ 72Vdc/63Vdc/32Vdc/24Vdc
Size: 1206 Type: Time-lag
Style: Surface Mount Fuses Series: 12.100
Feature: Compatible With Reflow And Wave Solder Application: Secondary Circuit Protection, Etc
Solder Pot Temperature: 260°C Max Solder Dwell Time: 10 Seconds Max
High Light:

250mA Surface Mount Fuses

,

1206 Surface Mount Fuses

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Miniature Chipe Type 1206 Fuse

Product Description

1206 Electronic Components Miniature Chipe Type Slow Blow Time-lag Time-Lag SMD Surface Mount Fuses

 

Electrical Characteristcs
 
Rated Current   % of AmpRating Opening Time
250mA~10A 100% 4hours, min
1A~3A 200% 1.0s - 60 s
1A~5A 250% 5.0s max
1A~5A 300% 0.1s - 3.0 s
250mA~750mA 350% 5.0s max
6A~10A 350% 5.0s max
250mA~10A 1000% 0.2ms - 20.0 ms

 

Specification

 

Part No. Rated Voltage Rated Current Breaking Capacity Typical Cold Resistance (mOhms)² Typical Voltage Drop (mV) Typical Pre-Arcing I²t
(A²Sec)³
Marking
12.100.0.25

72Vdc

125Vdc

63Vdc

32Vdc

24Vdc

250mA

100A@

72Vdc 125 Vdc

100A@

63Vdc

100A@

32Vdc 300A@

24Vdc

3700 1350 0.00038 I
12.100.0.375 375mA 1850 720 0.00077 E
12.100.0.5 500mA 1050 690 0.0019 B
12.100.0.75 750mA 775 680 0.15 C
12.100.1 1A 485 550 0.18 H
12.100.1.5 1.5A 218 355 0.4 K
12.100.2 2A 133 310 1.1 N
12.100.2.5 2.5A 79 230 1.7 O
12.100.3 3A 49 185 2.2 P
12.100.3.5 3.5A - 37 175 2.7 R
12.100.4 4A 33 160 3.2 S
12.100.4.5 4.5A 28 150 4.2 X
12.100.5 5A 22 135 6 T
12.100.6   - 6A - 15.5 140 12 F
12.100.7 7A 11.5 120 18 J
12.100.8 8A 8.0 100 18 V
12.100.10 10A 7.0 90 30 U

 

Description

 

1206 SLOW BLOW SMD FUSE
12.100 Series are the fuses set the industry standard for performance, reliability
and quality. The solder-free design provides excellent on-off and temperature
cycling characteristics during use and also makes our SMD fuses more heat and
shock tolerant than typical subminiature fuses.

 

Features


Rapid interruption of excessive current
Compatible with reflow and wave solder
Ceramic and glass construction
One time positive disconnect
Lead free and Halogen free material

 

Applicatons


Secondary circuit protection

Laptop, notebook, netbook

Flat panel displays
High definition television(HDTV)

LCD/LED backlighting Computers and peripherals

Gaming console systems

Handheld/portable equipment

Mobile device charges

Automotive
Central body control module
Heating ventilation and air conditioning

Doors,window lift and seat control

Digital instrument cluster
In-vehicle infotainment and navigation

Electric pumps,motor control

Powertrain control module(PCU)/Engine
Transimission Control Unit(TCU)

 

Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type 0

 

Installation Recommendations

 

Re?ow Conditon Pb-free assembly
Pre Heat - Temperature Min (Ts(min)) 150℃
- Temperature Max (Ts(max)) 200℃
- Time (Min to Max) (ts) 60 – 120 seconds
Average Ramp-up Rate (Liquidus Temp
(TL) to peak)
3℃/second max.
TS(max) to TL - Ramp-up Rate 5℃/second max.
Re?ow - Temperature (TL) (Liquidus)
- Temperature (tL)
217℃
60 – 150 seconds
Peak Temperature (TP) 260+0/-5℃
Time within 5°C of actual peak Temperature (tp) 30 seconds
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
6°C/second max
8 minutes max. 260°C

 

Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type 1

Product Characteristics
 
Materials Body: Ceramic
Terminatons: Silver over-plated with tin
Element: Alloy(Ag,Cu,Zn)
Cover Coat:Glass
Operatng Temperature -55°C to 125°C
Consult temperature rerating curve chart.
Thermal Shock 300 cycles -55°C to 125°C
Humidity MIL-STD-202F, Method 103B,Condition D
Vibraton Per MIL-STD-202F, Method 201A
Insulaton Resistance (Afer Opening) Greater than 10,000 ohms
Resistance to Soldering Heat MIL-STD-202G,Method 210F, Condition D

 

Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type 2

Packaging
3,000 pieces of fuses in plastic or paper taper
Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type 3
Symbol Ao Bo Ko Po P1 P2
Spec 1.80±0.10 3.50±0.10 1.27±0.10 4.00±0.10 4.00±0.10 2.00±0.10
Symbol E F Do D1 W T
Spec 1.75±0.10 3.50±0.10 1.50±0.10 1.00(Max) 8.00±0.10 0.23±0.02

 

Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type 4

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